On August 25, Ingenic Semiconductor Co., Ltd. (hereinafter referred to as “Ingenic”) successfully listed on the Hong Kong Stock Exchange (HKEX)! It became the seventh newly listed company in Haidian District in 2026, and the third enterprise in the district this year to achieve an “A+H” dual listing layout, following GigaDevice and SGMICRO. Ingenic issued 31,287,300 new shares in this listing at HKD 100 per share.
A Leading Domestic Fabless Chip Enterprise
Ingenic was registered and established in Haidian District in July 2005. It is a leading domestic fabless chip enterprise. The Company possesses fully proprietary self-developed CPU core technologies and has built three major product lines — memory chips, computing chips, and analog & connectivity chips — widely applied in automotive electronics, industrial and medical sectors, AIoT, and intelligent security devices.
According to the Frost & Sullivan report, by 2025 revenue, the Company ranked seventh globally and second in Chinese Mainland in the niche DRAM memory chip segment, and second globally and first in Chinese Mainland in the SRAM memory chip segment.
Publicly disclosed information shows that Ingenic achieved operating revenue of 1.56 billion yuan in Q1 2026, a year-on-year increase of 47.1%; net profit was 320 million yuan, a year-on-year increase of 334.6%. From 2023 to 2025, the Company recorded operating revenues of 4.531 billion yuan, 4.213 billion yuan, and 4.741 billion yuan, respectively; net profits of 516 million yuan, 364 million yuan, and 375 million yuan, respectively.
Based on the founding team’s innovative CPU design technology, Ingenic rapidly achieved the industrialization of SoC chips in the consumer electronics market, and was listed on the Growth Enterprise Market (GEM) of the Shenzhen Stock Exchange (SZSE) in May 2011. In this secondary listing in Hong Kong, the Company secured cornerstone investments from multiple renowned institutions including Emerald Prime, GF Fund, Singapore Huaqin, China Universal Asset Management (Hong Kong), and CloudAlpha Capital, with a subscription ratio approaching 50%.
Haidian District Is Home to Over 300 IC Design Enterprises
As the core hub for Beijing’s integrated circuit (IC) design, Haidian District has always been committed to cultivating hard-tech leading enterprises and building a competitive industrial ecosystem. The district is home to over 300 IC design enterprises, accounting for more than half of the city’s design industry. It boasts 12 listed companies and over 40 national‑level specialized, sophisticated, distinctive and innovative “Little Giant” enterprises. In 2025, two new listed companies were added — Moore Threads and OnMicro.
Haidian District’s IC design industry spans multiple segments including AI chips, CPU chips, communication chips, memory and main controller chips, and analog chips. It is home to numerous leading enterprises such as Cambricon, Moore Threads, Kunlunxin, Loongson Technology, and Horizon Robotics, with its AI chip and RISC-V architecture CPU chip sectors holding leading positions domestically.
In the integrated circuit (IC) field, Haidian District continuously refines its full-chain industrial service system. It has released the “Zhongguancun Science City IC Innovation Leadership Action Plan”, and issued the “Application Guide for the Integrated Circuit Tapeout Subsidy Program”, introducing tape-out subsidy policies that provide eligible enterprises with annual R&D support of up to 15 million yuan, effectively reducing innovation costs and strongly supporting the innovation cycle of “basic research — technological breakthroughs — achievement transformation.”
Among these, the Zhongguancun Integrated Circuit Park (IC PARK), located on Beiqing Road, covers a land area of 60,000 square meters with a total floor area of 220,000 square meters, and officially opened in November 2018. The park focuses on its primary responsibility of science and technology services, and has built a “1+3” IC industry service system. Based on spatial services, it provides specialized integrated services including common technologies, investment and financing, market access, policy support, talent development, and industrial collaboration.
To date, the park has gathered over 100 high-tech enterprises in the broad IC sector, including Horizon Robotics, GigaDevice, and AccoTest. Among them are 4 unicorn enterprises, 59 national high-tech enterprises, and 33 specialized, sophisticated, distinctive and innovative enterprises. It has preliminarily formed six characteristic industrial clusters: artificial intelligence, intelligent driving, Internet of Things (IoT), intelligent equipment, industrial chips, and information technology application innovation.
Meanwhile, Haidian District is strategically developing IC BAY in the northern area as a national IC design industry innovation highland. In March this year, IC BAY was officially launched in Wenquan Town. This agglomeration area, centered on Phase III of Wenquan Science Park with planned industrial space exceeding 2 million square meters, is positioned as a “National IC Design Industry Innovation Highland,” marking the formal transition of this strategic emerging industry cluster from blueprint to reality.
Haidian District’s 15th Five-Year Plan outlines a commitment to strengthening the IC design industry cluster. Focusing on the key technological foundation supporting AI self-reliance and self-strengthening, it prioritizes breakthroughs in bottlenecks such as AI chip design, optoelectronic integration, high-speed interconnect chips, HBM, and emerging memory technologies, achieving autonomous control over the three core pillars of computing power, data transport capacity, and storage capacity. The district will refine the IC design industry chain, solidifying the two foundational cores of chip design — Electronic Design Automation (EDA) tools and semiconductor intellectual property cores (chip IP). With scenario demands as the core driver, it will establish a “technology — scenario — ecosystem” collaborative matchmaking mechanism to promote the large-scale application of domestic chips in emerging scenarios such as computing infrastructure, embodied intelligence, and low-altitude economy. It will build the Zhongguancun Future Photonic Chip City, focusing on core areas such as photonic chips and optical communication devices, and gathering a cluster of internationally competitive optoelectronic enterprises. With Phase III of Wenquan Science Park as the primary carrier, it will make all-out efforts to build the IC Bay IC design industry agglomeration area.
Since the beginning of this year, Haidian District has added 7 listed companies, several of which have listed on the Hong Kong Stock Exchange. The Haidian District Financial Administration Bureau stated that it will continuously strengthen collaborative cooperation with HKEX, jointly intensify the discovery and cultivation of quality enterprises, continuously enhance the quality and effectiveness of enterprise listing service guarantees, support more regional technology enterprises in leveraging the Hong Kong stock platform to integrate global resources and expand development space, empower the construction of regional high-tech, precision, and advanced industry clusters through the capital market, and drive Haidian’s sci-tech innovation industry toward a new stage of higher-quality, higher-energy internationalized development.
It is understood that Haidian District has established a district‑level listing task force, built a full‑cycle service chain, maintained a dynamic roster of key pre‑listing enterprises, and facilitated the centralized setup of service windows by the Shanghai Stock Exchange (SSE), Shenzhen Stock Exchange (SZSE), Beijing Stock Exchange (BSE), and Hong Kong Exchanges and Clearing Limited (HKEX) in the Zhongguancun West Area.
